Title: The Basics of Soldering / Edition 1, Author: Armin Rahn
Title: Advanced Materials for Thermal Management of Electronic Packaging / Edition 1, Author: Xingcun Colin Tong
Title: Soldering Processes and Equipment / Edition 1, Author: Michael Pecht
Title: The Handbook of Machine Soldering: SMT and TH / Edition 3, Author: Ralph W. Woodgate
Title: Thermal Design of Electronic Equipment / Edition 1, Author: Ralph Remsburg
Title: Mechanical Analysis of Electronic Packaging Systems / Edition 1, Author: Mckeown
Title: Package Electrical Modeling, Thermal Modeling, and Processing for GaAs Wireless Applications / Edition 1, Author: Dean L. Monthei
Title: High-Frequency Characterization of Electronic Packaging / Edition 1, Author: Luc Martens
Title: High Temperature Electronics / Edition 1, Author: F. Patrick McCluskey
Title: Guidebook for Managing Silicon Chip Reliability / Edition 1, Author: Michael Pecht
Title: Handbook of Polymer Coatings for Electronics: Chemistry, Technology and Applications / Edition 2, Author: James J. Licari
Title: Contamination of Electronic Assemblies / Edition 1, Author: Elissa M. Bumiller
Title: Multilayer Ceramic Substrate - Technology for VLSI Package/Multichip Module: Ceramic research and development in Japan / Edition 1, Author: K. Otsuka
Title: Electronic Equipment Packaging Technology / Edition 1, Author: Gerald L. Ginsberg
Title: Manufacturing Challenges in Electronic Packaging / Edition 1, Author: Y.C. Lee
Title: Power Electronic Packaging: Design, Assembly Process, Reliability and Modeling / Edition 1, Author: Yong Liu
Title: Fundamentals and Essentials of Electronic Packaging, Author: Puligandla Viswanadham
Title: Laser Diode Chip and Packaging Technology, Author: Pei C. Chen
Title: LED Packaging for Lighting Applications: Design, Manufacturing, and Testing / Edition 1, Author: Shen Liu
Title: Electronic Packaging Materials and Their Properties / Edition 1, Author: Michael Pecht

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