Title: Fundamentals and Essentials of Electronic Packaging, Author: Puligandla Viswanadham
Title: Air Cooling Technology for Electronic Equipment / Edition 1, Author: Sung Jin Kim
Title: Influence of Temperature on Microelectronics and System Reliability: A Physics of Failure Approach / Edition 1, Author: Pradeep Lall
Title: Mechanical Analysis of Electronic Packaging Systems / Edition 1, Author: Mckeown
Title: High Temperature Electronics / Edition 1, Author: F. Patrick McCluskey
Title: Handbook Of Tape Automated Bonding / Edition 1, Author: John H. Lau
Title: High-Frequency Characterization of Electronic Packaging / Edition 1, Author: Luc Martens
Title: Failure Modes and Mechanisms in Electronic Packages / Edition 1, Author: P. Singh
Title: Power Electronic Packaging: Design, Assembly Process, Reliability and Modeling / Edition 1, Author: Yong Liu
Title: Contamination of Electronic Assemblies / Edition 1, Author: Elissa M. Bumiller
Title: Adhesives Technology for Electronic Applications: Materials, Processing, Reliability / Edition 2, Author: James J. Licari
Title: The Basics of Soldering / Edition 1, Author: Armin Rahn
Title: Electronic Packaging Materials and Their Properties / Edition 1, Author: Michael Pecht
Title: LED Packaging for Lighting Applications: Design, Manufacturing, and Testing / Edition 1, Author: Shen Liu
Title: Practical Guide to the Packaging of Electronics: Thermal and Mechanical Design and Analysis, Third Edition / Edition 3, Author: Ali Jamnia
Title: Hermeticity of Electronic Packages / Edition 2, Author: Hal Greenhouse
Title: Handbook of Lead-Free Solder Technology for Microelectronic Assemblies / Edition 1, Author: Karl J. Puttlitz
Title: Modeling and Design of Electromagnetic Compatibility for High-Speed Printed Circuit Boards and Packaging / Edition 1, Author: Xing-Chang Wei
Title: Multilayer Ceramic Substrate - Technology for VLSI Package/Multichip Module: Ceramic research and development in Japan / Edition 1, Author: K. Otsuka
Title: Quality Conformance and Qualification of Microelectronic Packages and Interconnects / Edition 1, Author: Michael Pecht

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