Title: The Electronic Packaging Handbook / Edition 1, Author: Glenn R. Blackwell
Title: Physical Design for Multichip Modules / Edition 1, Author: Mysore Sriram
Title: Mechanical Analysis of Electronic Packaging Systems / Edition 1, Author: Mckeown
Title: Failure Modes and Mechanisms in Electronic Packages / Edition 1, Author: P. Singh
Title: Quality Conformance and Qualification of Microelectronic Packages and Interconnects / Edition 1, Author: Michael Pecht
Title: Adhesives Technology for Electronic Applications: Materials, Processing, Reliability / Edition 2, Author: James J. Licari
Title: Power Electronic Packaging: Design, Assembly Process, Reliability and Modeling / Edition 1, Author: Yong Liu
Title: Package Electrical Modeling, Thermal Modeling, and Processing for GaAs Wireless Applications / Edition 1, Author: Dean L. Monthei
Title: Influence of Temperature on Microelectronics and System Reliability: A Physics of Failure Approach / Edition 1, Author: Pradeep Lall
Title: MCM C/Mixed Technologies and Thick Film Sensors / Edition 1, Author: W.K. Jones
Title: LED Packaging for Lighting Applications: Design, Manufacturing, and Testing / Edition 1, Author: Shen Liu
Title: Practical Guide to the Packaging of Electronics: Thermal and Mechanical Design and Analysis, Third Edition / Edition 3, Author: Ali Jamnia
Title: The Basics of Soldering / Edition 1, Author: Armin Rahn
Title: Microscale Heat Transfer - Fundamentals and Applications: Proceedings of the NATO Advanced Study Institute on Microscale Heat Transfer - Fundamentals and Applications in Biological and Microelectromechanical Systems, Cesme-Izmir, Turkey, 18-30 July, 2004 / Edition 1, Author: S. Kakaï
Title: Materials for Electronic Packaging, Author: Deborah D.L. Chung
Title: Boundary-Scan Interconnect Diagnosis / Edition 1, Author: Josï T. de Sousa
Title: Handbook Of Tape Automated Bonding / Edition 1, Author: John H. Lau
Title: Multilayer Ceramic Substrate - Technology for VLSI Package/Multichip Module: Ceramic research and development in Japan / Edition 1, Author: K. Otsuka
Title: Electronic Packaging and Interconnection Handbook / Edition 4, Author: Charles A. Harper
Title: Guidebook for Managing Silicon Chip Reliability / Edition 1, Author: Michael Pecht

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