3D IC Stacking Technology / Edition 1

by Ajay Kumar, Sesh Ramaswami, Banqiu Wu

Overview

With a focus on industrial applications, 3D IC Stacking Technology offers comprehensive coverage of design, test, and fabrication processing methods for three-dimensional device integration. Each chapter in this authoritative guide is written by industry experts and details a separate fabrication step. Future industry applications and cutting-edge design potential are also discussed. This is an essential resource for semiconductor engineers and portable device designers.

3D IC Stacking Technology covers:

• High density through silicon stacking (TSS) technology
• Practical design ecosystem for heterogeneous 3D IC products
• Design automation and TCAD tool solutions for through silicon via (TSV)-based 3D IC stack
• Process integration for TSV manufacturing
• High-aspect-ratio silicon etch for TSV
• Dielectric deposition for TSV
• Barrier and seed deposition
• Copper electrodeposition for TSV
• Chemical mechanical polishing for TSV applications
• Temporary and permanent bonding
• Assembly and test aspects of TSV technology

Product Details

ISBN-13:	9780071741958
Publisher:	McGraw Hill LLC
Publication date:	07/07/2011
Edition description:	New Edition
Pages:	544
Product dimensions:	6.10(w) x 9.00(h) x 1.00(d)

About the Author

Banqiu Wu is Chief Technology Officer, TSV and Mask Products Business Group, Applied Materials, Inc. Dr. Wu has published over 50 technological papers in 10 peer-reviewed journals and conference proceedings, and authored/co-authored several books, including Photomask Fabrication Technology and Extreme Ultraviolet Lithography. He holds multiple patents and awards.

Dr. Ajay Kumar is Vice President and General Manager of TSV and Mask Products Business Group, Applied Materials, Inc. He has more than 75 publications to his credit in various journals including several review articles. Dr. Kumar co-authored the book Extreme Ultraviolet Lithography. He holds more than 100 US patents and has won many awards for innovation and commercialization.

Sesh Ramaswami is a senior director of TSV strategy and marketing at Applied Materials, Inc. His responsibilities include TSV and associated wafer level processing for packaging. Ramaswami holds 35 US patents and has 40+ conference publications and presentations in conferences such as MRS, ECS, VMIC, AVS, SPIE and IRPS.

Table of Contents

Chapter 1. Introduction to High-Density Through Silicon Stacking Technology
Chapter 2. A Practical Design Eco-System for Heterogeneous 3D IC Products
Chapter 3. Design Automation and TCAD Tool Solutions for Through Silicon Via-Based 3D IC Stack
Chapter 4. Process Integration for TSV Manufacturing
Chapter 5. High-Aspect-Ratio Silicon Etch for TSV
Chapter 6. Dielectric Deposition for Through Silicon Vias
Chapter 7. Barrier and Seed Deposition
Chapter 8. Copper Electrodeposition for TSV
Chapter 9. Chemical Mechanical Polishing for TSV
Chapter 10. Temporary and Permanent Bonding
Chapter 11. Assembly and Test Aspects of TSV Technology
Index