Bonding in Microsystem Technology / Edition 1

by Jan A. Dziuban

Overview

Bonding in Microsystem Technology starts with descriptions of terminology, kinds of microsystems and market analysis. Followed by the presentation of mechanisms of wet etching, set of process parameters, description of micromachining methods, examples of procedures, process flow-charts and applications of basic micromechanical structures in microsystems are shown. Next, high-temperature, low temperature and room-temperature bonding and their applications in microsystem technology are presented. The following part of the book contains the detailed description of anodic bonding, starting from analysis of properties of glasses suitable for anodic bonding, and discussion of the nature of the process. Next all types of anodic bonding and sealing procedures used in microsystem technology are presented. This part of the book finishes with examples of applications of anodic bonding in microsystem technology taken from the literature but mainly based on the author’s personal experience.

Product Details

ISBN-13:	9781402045783
Publisher:	Springer Netherlands
Publication date:	07/26/2006
Series:	Springer Series in Advanced Microelectronics , #24
Edition description:	2006
Pages:	334
Product dimensions:	6.14(w) x 9.25(h) x 0.03(d)

Table of Contents

Some Remarks on Microsystem Systematics and Development.- Deep, Three-Dimensional Silicon Micromachining.- Bonding.- Classification of Bonding and Closing Remarks.

Editorial Reviews

From the reviews:

"Any one interested in bonding in microsystem technology will likely be well served by this outstanding volume which is addressed to scientists and researchers, as well as to academic teachers and students, engineers active in the field of electric/electronics and microelectronics. … Technological results presented in the book have been tested experimentally by the author and his team, and can be utilized in day-to-day laboratory practice. Special attention has been paid to the highest level of accessibility of the book by students." (Current Engineering Practice, 2007)

From the Publisher