Chip On Board: Technology for Multichip Modules / Edition 1

by John H. Lau

Overview

This book is a one-stop guide to the state of the art of COB technology. For professionals active in COB and MCM research and development, those who wish to master COB and MCM problem-solving methods, and those who must choose a cost-effective design and high-yield manufacturing process for their interconnect systems, here is a timely summary of progress in al aspects of this fascinating field.
It meets the reference needs of design, material, process, equipment, manufacturing, quality, reliability, packaging, and system engineers, and technical managers working in electronic packaging and interconnection.

Product Details

ISBN-13:	9780442014414
Publisher:	Springer US
Publication date:	06/30/1994
Series:	E; Ectrical Engineering
Edition description:	1994
Pages:	556
Product dimensions:	6.10(w) x 9.25(h) x 0.05(d)

Table of Contents

Preface; Acknowledgments; A brief introduction to wire bonding, tape automated bonding, and flip chip on board for multichip module applications; Making COB testing tractable: chip pretest and system diagnostics; Chip level interconnect; wire bonding for multichip modules; Chip level interconnect: wafer bumping and inner lead bonding; Chip level interconnect: solder bumped flip chip; Chip attachment; Wire bonding chip on board; Tape automated bonding chip on board and on MCM-D; Solder bumped flip chip attach on SLC board and multichip module; Micron bump bonding chip on board; chip on board encapsulation; Underfill encapsulation for flip chip applications; Index

Editorial Reviews

Chapters by various experts provide a reference for design, materials, processes, equipment, manufacturing, quality, reliability, packaging, and system engineers and technical managers. Topics include wire bonding, TAB, flip COB, testing, wafer bumping and inner lead bonding, solder bumped flip chips, chip attachments, wire bonding chip and TAB chip on board, micro bump bonding chips, chip on board encapsulation, and underfill encapsulation for flip chips. All those chips and no salsa. Annotation c. Book News, Inc., Portland, OR (booknews.com)

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