Design for Manufacturability: From 1D to 4D for 90-22 nm Technology Nodes / Edition 1

by Artur Balasinski

Overview

This book explains integrated circuit design for manufacturability (DfM) at the product level (packaging, applications) and applies engineering DfM principles to the latest standards of product development at 22 nm technology nodes. It is a valuable guide for layout designers, packaging engineers and quality engineers, covering DfM development from 1D to 4D, involving IC design flow setup, best practices, links to manufacturing and product definition, for process technologies down to 22 nm node, and product families including memories, logic, system-on-chip and system-in-package.

Product Details

ISBN-13:	9781461417606
Publisher:	Springer New York
Publication date:	10/06/2013
Edition description:	2014
Pages:	278
Product dimensions:	6.10(w) x 9.25(h) x 0.03(d)

About the Author

Artur Balasinski is a Technology Design Integration Manager for Cypress Semiconductor in San Jose, California.

Table of Contents

Preface.- Classic DfM: from 2D to 3D.- DfM at 28 nm and Beyond.- New DfM Domain: Stress Effects.- Conclusions and Future Work.