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Overview
Electromagnetic Compatibility Engineering is a completely revised, expanded, and updated version of Henry Ott's popular book Noise Reduction Techniques in Electronic Systems. It reflects the most recent developments in the field of electro-magnetic compatibility (EMC) and noise reduction and their practical applications to the design of analog and digital circuits in computer, home entertainment, medical, telecom, industrial process control, and automotive equipment, as well as military and aerospace systems.
While maintaining and updating the core information-such as cabling, grounding, filtering, shielding, digital circuit grounding and layout, and ESD-that made the previous book such a wide success, this new book includes additional coverage of:
Equipment/systems grounding
Switching power supplies and variable-speed motor drives
Digital circuit Power distribution and decoupling
PCB layout and stack-up
Mixed-signal PCB layout
RF and transient immunity
Power line disturbances
Precompliance EMC measurements
New appendices on dipole antennae, the theory of partial inductance, and the ten most common EMC problems
The concepts presented are applicable to analog and digital circuits operating from below audio frequencies to those in the GHz range. Throughout the book, an emphasis is placed on cost-effective EMC designs, with the amount and complexity of mathematics kept to the strictest minimum.
Complemented with over 250 problems with answers, Electromagnetic Compatibility Engineering equips readers with the knowledge needed to design electronic equipment that is compatible with the electromagnetic environment and complaint with national and internationalEMC regulations. It is an essential resource for practicing engineers who face EMC and regulatory compliance issues and an ideal textbook for EE courses at the advanced undergraduate and graduate levels.
Product Details
| ISBN-13: | 9781118210659 |
|---|---|
| Publisher: | Wiley |
| Publication date: | 09/20/2011 |
| Sold by: | JOHN WILEY & SONS |
| Format: | eBook |
| Pages: | 880 |
| File size: | 28 MB |
| Note: | This product may take a few minutes to download. |
About the Author
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Table of Contents
Preface xxiii
Part 1 EMC Theory 1
1 Electromagnetic Compatibility 3
1.1 Introduction 3
1.2 Noise and Interference 3
1.3 Designing for Electromagnetic Compatibility 4
1.4 Engineering Documentation and EMC 6
1.5 United States' EMC Regulations 6
1.5.1 FCC Regulations 6
1.5.2 FCC Part 15, Subpart B 8
1.5.3 Emissions 11
1.5.4 Administrative Procedures 14
1.5.5 Susceptibility 17
1.5.6 Medical Equipment 17
1.5.7 Telecom 18
1.5.8 Automotive 19
1.6 Canadian EMC Requirements 19
1.7 European Union's EMC Requirements 20
1.7.1 Emission Requirements 20
1.7.2 Harmonics and Flicker 22
1.7.3 Immunity Requirements 23
1.7.4 Directives and Standards 23
1.8 International Harmonization 26
1.9 Military Standards 27
1.10 Avionics 28
1.11 The Regulatory Process 30
1.12 Typical Noise Path 30
1.13 Methods of Noise Coupling 31
1.13.1 Conductively Coupled Noise 31
1.13.2 Common Impedance Coupling 32
1.13.3 Electric and Magnetic Field Coupling 33
1.14 Miscellaneous Noise Sources 33
1.14.1 Galvanic Action 33
1.14.2 Electrolytic Action 35
1.14.3 Triboelectric Effect 35
1.14.4 Conductor Motion 36
1.15 Use of Network Theory 36
Summary 38
Problems 39
References 41
Further Reading 42
2 Cabling 44
2.1 Capacitive Coupling 45
2.2 Effect of Shield on Capacitive Coupling 48
2.3 Inductive Coupling 52
2.4 Mutual Inductance Calculations 54
2.5 Effect of Shield on Magnetic Coupling 56
2.5.1 Magnetic Coupling Between Shield and Inner Conductor 58
2.5.2 Magnetic Coupling-Open Wire to Shielded Conductor 61
2.6 Shielding to Prevent Magnetic Radiation 64
2.7 Shielding a Receptor Against Magnetic Fields 67
2.8 Common Impedance ShieldCoupling 69
2.9 Experimental Data 70
2.10 Example of Selective Shielding 74
2.11 Shield Transfer Impedance 75
2.12 Coaxial Cable Versus Twisted Pair 75
2.13 Braided Shields 79
2.14 Spiral Shields 81
2.15 Shield Terminations 84
2.15.1 Pigtails 84
2.15.2 Grounding of Cable Shields 88
2.16 Ribbon Cables 94
2.17 Electrically Long Cables 96
Summary 96
Problems 98
References 103
Further Reading 104
3 Grounding 106
3.1 AC Power Distribution and Safety Grounds 107
3.1.1 Service Entrance 108
3.1.2 Branch Circuits 109
3.1.3 Noise Control 111
3.1.4 Earth Grounds 114
3.1.5 Isolated Grounds 116
3.1.6 Separately Derived Systems 118
3.1.7 Grounding Myths 119
3.2 Signal Grounds 120
3.2.1 Single-Point Ground Systems 124
3.2.2 Multipoint Ground Systems 126
3.2.3 Common Impedance Coupling 128
3.2.4 Hybrid Grounds 130
3.2.5 Chassis Grounds 131
3.3 Equipment/System Grounding 132
3.3.1 Isolated Systems 133
3.3.2 Clustered Systems 133
3.3.3 Distributed Systems 140
3.4 Ground Loops 142
3.5 Low-Frequency Analysis of Common-Mode Choke 147
3.6 High-Frequency Analysis of Common-Mode Choke 152
3.7 Single Ground Reference for a Circuit 154
Summary 155
Problems 156
References 157
Further Reading 157
4 Balancing and Filtering 158
4.1 Balancing 158
4.1.1 Common-Mode Rejection Ratio 161
4.1.2 Cable Balance 165
4.1.3 System Balance 166
4.1.4 Balanced Loads 166
4.2 Filtering 174
4.2.1 Common-Mode Filters 174
4.2.2 Parasitic Effects in Filters 177
4.3 Power Supply Decoupling 178
4.3.1 Low-Frequency Analog Circuit Decoupling 183
4.3.2 Amplifier Decoupling 185
4.4 Driving Capacitive Loads 186
4.5 System Bandwidth 188
4.6 Modulation and Coding 190
Summary 190
Problems 191
References 192
Further Reading 193
5 Passive Components 194
5.1 Capacitors 194
5.1.1 Electrolytic Capacitors 195
5.1.2 Film Capacitors 197
5.1.3 Mica and Ceramic Capacitors 198
5.1.4 Feed-Through Capacitors 200
5.1.5 Paralleling Capacitors 202
5.2 Inductors 203
5.3 Transformers 204
5.4 Resistors 206
5.4.1 Noise in Resistors 207
5.5 Conductors 208
5.5.1 Inductance of Round Conductors 209
5.5.2 Inductance of Rectangular Conductors 210
5.5.3 Resistance of Round Conductors 211
5.5.4 Resistance of Rectangular Conductors 213
5.6 Transmission Lines 215
5.6.1 Characteristic Impedance 217
5.6.2 Propagation Constant 220
5.6.3 High-Frequency Loss 221
5.6.4 Relationship Among C, L and εr. 224
5.6.5 Final Thoughts 225
5.7 Ferrites 225
Summary 233
Problems 234
References 237
Further Reading 237
6 Shielding 238
6.1 Near Fields and Far Fields 238
6.2 Characteristic and Wave Impedances 241
6.3 Shielding Effectiveness 243
6.4 Absorption Loss 245
6.5 Reflection Loss 249
6.5.1 Reflection Loss to Plane Waves 252
6.5.2 Reflection Loss in the Near Field 253
6.5.3 Electric Field Reflection Loss 254
6.5.4 Magnetic Field Reflection Loss 255
6.5.5 General Equations for Reflection Loss 256
6.5.6 Multiple Reflections in Thin Shields 256
6.6 Composite Absorption and Reflection Loss 257
6.6.1 Plane Waves 257
6.6.2 Electric Fields 258
6.6.3 Magnetic Fields 259
6.7 Summary of Shielding Equations 260
6.8 Shielding with Magnetic Materials 260
6.9 Experimental Data 265
6.10 Apertures 267
6.10.1 Multiple Apertures 270
6.10.2 Seams 273
6.10.3 Transfer Impedance 277
6.11 Waveguide Below Cutoff 280
6.12 Conductive Gaskets 282
6.12.1 Joints of Dissimilar Metals 283
6.12.2 Mounting of Conductive Gaskets 284
6.13 The "Ideal" Shield 287
6.14 Conductive Windows 288
6.14.1 Transparent Conductive Coatings 288
6.14.2 Wire Mesh Screens 289
6.14.3 Mounting of Windows 289
6.15 Conductive Coatings 289
6.15.1 Conductive Paints 291
6.15.2 Flame/Arc Spray 291
6.15.3 Vacuum Metalizing 291
6.15.4 Electroless Plating 292
6.15.5 Metal Foil Linings 292
6.15.6 Filled Plastic 293
6.16 Internal Shields 293
6.17 Cavity Resonance 295
6.18 Grounding of Shields 296
Summary 296
Problems 297
References 299
Further Reading 300
7 Contact Protection 302
7.1 Glow Discharges 302
7.2 Metal-Vapor or Arc Discharges 303
7.3 AC Versus DC Circuits 305
7.4 Contact Material 306
7.5 Contact Rating 306
7.6 Loads with High Inrush Currents 307
7.7 Inductive Loads 308
7.8 Contact Protection Fundamentals 310
7.9 Transient Suppression for Inductive Loads 314
7.10 Contact Protection Networks for Inductive Loads 318
7.10.1 C Network 318
7.10.2 R-C Network 318
7.10.3 R-C-D Network 321
7.11 Inductive Loads Controlled by a Transistor Switch 322
7.12 Resistive Load Contact Protection 323
7.13 Contact Protection Selection Guide 323
7.14 Examples 324
Summary 325
Problems 326
References 327
Further Reading 327
8 Intrinsic Noise Sources 328
8.1 Thermal Noise 328
8.2 Characteristics of Thermal Noise 332
8.3 Equivalent Noise Bandwidth 334
8.4 Shot Noise 337
8.5 Contact Noise 338
8.6 Popcorn Noise 339
8.7 Addition of Noise Voltages 340
8.8 Measuring Random Noise 341
Summary 342
Problems 343
References 345
Further Reading 345
9 Active Device Noise 346
9.1 Noise Factor 346
9.2 Measurement of Noise Factor 349
9.2.1 Single-Frequency Method 349
9.2.2 Noise Diode Method 350
9.3 Calculating S/N Ratio and Input Noise Voltage from Noise Factor 351
9.4 Noise Voltage and Current Model 353
9.5 Measurment of Vn and In 355
9.6 Calculating Noise Factor and S/N Radio from Vn-In 356
9.7 Optimum Source Resistance 357
9.8 Noise Factor of Cascaded Stages 360
9.9 Noise Temperature 362
9.10 Bipolar Transistor Noise 364
9.10.1 Transistor Noise Factor 365
9.10.2 Vn-In for Transistors 367
9.11 Field-Effect Transistor Noise 368
9.11.1 FET Noise Factor 368
9.11.2 Vn-In Representation of FET Noise 370
9.12 Noise in Operational Amplifiers 370
9.12.1 Methods of Specifying Op-Amp Noise 373
9.12.2 Op-Amp Noise Factor 375
Summary 375
Problems 376
References 377
Further Reading 378
10 Digital Circuit Grounding 379
10.1 Frequency Versus Time Domain 380
10.2 Analog Versus Digital Circuits 380
10.3 Digital Logic Noise 380
10.4 Internal Noise Sources 381
10.5 Digital Circuit Ground Noise 384
10.5.1 Minimizing Inductance 385
10.5.2 Mutual Inductance 386
10.5.3 Practical Digital Circuit Ground Systems 388
10.5.4 Loop Area 390
10.6 Ground Plane Current Distribution and Impedance 391
10.6.1 Reference Plane Current Distribution 392
10.6.2 Ground Plane Impedance 400
10.6.3 Ground Plane Voltage 408
10.6.4 End Effects 409
10.7 Digital Logic Current Flow 412
10.7.1 Microstrip Line 414
10.7.2 Stripline 415
10.7.3 Digital Circuit Current Flow Summary 418
Summary 419
Problems 420
References 421
Further Reading 422
Part 2 EMC Applications 423
11 Digital Circuit Power Distribution 425
11.1 Power Supply Decoupling 425
11.2 Transient Power Supply Currents 426
11.2.1 Transient Load Current 428
11.2.2 Dynamic Internal Current 428
11.2.3 Fourier Spectrum of the Transient Current 429
11.2.4 Total Transient Current 431
11.3 Decoupling Capacitors 431
11.4 Effective Decoupling Strategies 436
11.4.1 Multiple Decoupling Capacitors 437
11.4.2 Multiple Capacitors of the Same Value 437
11.4.3 Multiple Capacitors of Two Different Values 440
11.4.4 Multiple Capacitors of Many Different Values 444
11.4.5 Target Impedance 445
11.4.6 Embedded PCB Capacitance 447
11.4.7 Power Supply Isolation 452
11.5 The Effect of Decoupling on Radiated Emissions 454
11.6 Decoupling Capacitor Type and Value 456
11.7 Decoupling Capacitor Placement and Mounting 457
11.8 Bulk Decoupling Capacitors 459
11.9 Power Entry Filters 460
Summary 461
Problems 461
References 463
Further Reading 463
12 Digital Circuit Radiation 464
12.1 Differential-Mode Radiation 465
12.1.1 Loop Area 468
12.1.2 Loop Current 468
12.1.3 Fourier Series 468
12.1.4 Radiated Emission Envelope 470
12.2 Controlling Differential-Mode Radiation 471
12.2.1 Board Layout 471
12.2.2 Canceling Loops 474
12.2.3 Dithered Clocks 475
12.3 Common-Mode Radiation 477
12.4 Controlling Common-Mode Radiation 480
12.4.1 Common-Mode Voltage 481
12.4.2 Cable Filtering and Shielding 482
12.4.3 Separate I/O Grounds 485
12.4.4 Dealing With Common-Mode Radiation Issues 488
Summary 488
Problems 489
References 490
Further Reading 491
13 Conducted Emissions 492
13.1 Power Line Impedance 492
13.1.1 Line Impedance Stabilization Network 494
13.2 Switched-Mode Power Supplies 495
13.2.1 Common-Mode Emissions 498
13.2.2 Differential-Mode Emissions 501
13.2.3 DC-to-DC Converters 509
13.2.4 Rectifier Diode Noise 509
13.3 Power-Line Filters 511
13.3.1 Common-Mode Filtering 512
13.3.2 Differential-Mode Filtering 512
13.3.3 Leakage Inductance 513
13.3.4 Filter Mounting 516
13.3.5 Power Supplies with Integral Power-Line Filters 519
13.3.6 High-Frequency Noise 520
13.4 Primary-to-Secondary Common-Mode Coupling 523
13.5 Frequency Dithering 524
13.6 Power Supply Instability 524
13.7 Magnetic Field Emissions 525
13.8 Variable Speed Motor Drives 528
13.9 Harmonic Suppression 536
13.9.1 Inductive Input Filters 538
13.9.2 Active Power Factor Correction 538
13.9.3 AC Line Reactors 539
Summary 541
Problems 542
References 544
Further Reading 544
14 RF and Transient Immunity 545
14.1 Performance Criteria 545
14.2 RF Immunity 546
14.2.1 The RF Environment 547
14.2.2 Audio Rectification 548
14.2.3 RFI Mitigation Techniques 549
14.3 Transient Immunity 557
14.3.1 Electrostatic Discharge 558
14.3.2 Electrical Fast Transient 558
14.3.3 Lightning Surge 559
14.3.4 Transient Suppression Networks 560
14.3.5 Signal Line Suppression 561
14.3.6 Protection of High-Speed Signal Lines 564
14.3.7 Power Line Transient Suppression 566
14.3.8 Hybrid Protection Network 570
14.4 Power Line Disturbances 572
14.4.1 Power Line Immunity Curve 573
Summary 575
Problems 576
References 578
Further Reading 579
15 Electrostatic Discharge 580
15.1 Static Generation 580
15.1.1 Inductive Charging 583
15.1.2 Energy Storage 585
15.2 Human Body Model 587
15.3 Static Discharge 589
15.3.1 Decay Time 590
15.4 ESD Protection in Equipment Design 592
15.5 Preventing ESD Entry 594
15.5.1 Metallic Enclosures 595
15.5.2 Input/Output Cable Treatment 599
15.5.3 Insulated Enclosures 604
15.5.4 Keyboards and Control Panels 607
15.6 Hardening Sensitive Circuits 608
15.7 ESD Grounding 608
15.8 Nongrounded Products 609
15.9 Field-Induced Upset 610
15.9.1 Inductive Coupling 611
15.9.2 Capacitive Coupling 611
15.10 Transient Hardened Software Design 612
15.10.1 Detecting Errors in Program Flow 613
15.10.2 Detecting Errors in Input/Output 614
15.10.3 Detecting Errors in Memory 616
15.11 Time Windows 617
Summary 617
Problems 619
References 620
Further Reading 621
16 PCB Layout and Stackup 622
16.1 General PCB Layout Considerations 622
16.1.1 Partitioning 622
16.1.2 Keep Out Zones 622
16.1.3 Critical Signals 623
16.1.4 System Clocks 624
16.2 PCB-to-Chassis Ground Connection 625
16.3 Return Path Discontinuities 626
16.3.1 Slots in Ground/Power Planes 627
16.3.2 Split Ground/Power Planes 628
16.3.3 Changing Reference Planes 630
16.3.4 Referencing the Top and Bottom of the Same Plane 633
16.3.5 Connectors 634
16.3.6 Ground Fill 634
16.4 PCB Layer Stackup 635
16.4.1 One- and Two-Layer Boards 636
16.4.2 Multilayer Boards 637
16.4.3 General PCB Design Procedure 653
Summary 655
Problems 657
References 658
Further Reading 658
17 Mixed-Signal PCB Layout 660
17.1 Split Ground Planes 660
17.2 Microstrip Ground Plane Current Distribution 662
17.3 Analog and Digital Ground Pins 665
17.4 When Should Split Ground Planes Be Used? 668
17.5 Mixed Signal ICs 669
17.5.1 Multi-Board Systems 671
17.6 High-Resolution A/D and D/A Converters 671
17.6.1 Stripline 673
17.6.2 Asymmetric Stripline 674
17.6.3 Isolated Analog and Digital Ground Planes 675
17.7 A/D and D/A Converter Support Circuitry 676
17.7.1 Sampling Clocks 676
17.7.2 Mixed-Signal Support Circuitry 678
17.8 Vertical Isolation 679
17.9 Mixed-Signal Power Distribution 681
17.9.1 Power Distribution 681
17.9.2 Decoupling 682
17.10 The IPC Problem 684
Summary 685
Problems 686
References 687
Further Reading 687
18 Precompliance EMC Measurements 688
18.1 Test Environment 689
18.2 Antennas Versus Probes 689
18.3 Common-Mode Currents on Cables 690
18.3.1 Test Procedure 693
18.3.2 Cautions 693
18.4 Near Field Measurements 694
18.4.1 Test Procedure 695
18.4.2 Cautions 696
18.4.3 Seams and Apertures in Enclosures 697
18.5 Noise Voltage Measurements 697
18.5.1 Balanced Differential Probe 698
18.5.2 DC to 1-GHz Probe 700
18.5.3 Cautions 700
18.6 Conducted Emission Testing 700
18.6.1 Test Procedure 702
18.6.2 Cautions 703
18.6.3 Separating C-M from D-M Noise 704
18.7 Spectrum Analyzers 707
18.7.1 Detector Functions 709
18.7.2 General Test Procedure 710
18.8 EMC Crash Cart 711
18.8.1 Mitigation Parts List 712
18.9 One-Meter Radiated Emission Measurements 713
18.9.1 Test Environment 713
18.9.2 Limits for 1-m Testing 713
18.9.3 Antennas for 1-m Testing 714
18.10 Precompliance Immunity Testing 717
18.10.1 Radiated Immunity 717
18.10.2 Conducted Immunity 720
18.10.3 Transient Immunity 721
18.11 Precompliance Power Quality Tests 723
18.11.1 Harmonics 724
18.11.2 Flicker 725
18.12 Margin 726
18.12.1 Radiated Emission Margin 726
18.12.2 Electrostatic Discharge Margin 727
Summary 728
Problems 729
References 730
Further Reading 731
Appendix 733
A The Decibel 733
A.1 Properties of Logarithms 733
A.2 Using the Decibel for Other than Power Measurements 734
A.3 Power Loss or Negative Power Gain 736
A.4 Absolute Power Level 736
A.5 Summing Powers Expressed in Decibels 738
B The Ten Best Ways to Maximize the Emission from Your Product 740
C Multiple Reflections of Magnetic Fields in Thin Shields 743
D Dipoles for Dummies 746
D.1 Basic Dipoles for Dummies 746
D.2 Intermediate Dipoles for Dummies 751
D.3 Advanced Dipoles for Dummies 756
D.3.1 Impedance of a Dipole 756
D.3.2 Dipole Resonance 756
D.3.3 Receiving Dipole 759
D.3.4 Theory of Images 759
D.3.5 Dipole Arrays 761
D.3.6 Very High-Frequency Dipoles 763
Summary 763
Further Reading 764
E Partial Inductance 765
E.1 Inductance 765
E.2 Loop Inductance 767
E.2.1 Inductance of a Rectangular Loop 768
E.3 Partial Inductance 770
E.3.1 Partial Self-Inductance 771
E.3.2 Partial Mutual Inductance 773
E.3.3 Net Partial-Inductance 776
E.3.4 Partial Inductance Applications 776
E.3.5 Transmission Line Example 778
E.4 Ground Plane Inductance Measurement Test Setup 780
E.5 Inductance Notation 785
Summary 788
References 788
Further Reading 789
F Answers to Problems 790
Index 825