Electronic Equipment Packaging Technology / Edition 1

by Gerald L. Ginsberg

Overview

The last twenty years have seen major advances in the electronics industry. Perhaps the most significant aspect of these advances has been the significant role that electronic equipment plays in almost all product markets. Even though electronic equipment is used in a broad base of applications, many future applications have yet to be conceived. This versatility of electron­ ics has been brought about primarily by the significant advances that have been made in integrated circuit technology. The electronic product user is rarely aware of the integrated circuits within the equipment. However, the user is often very aware of the size, weight, mod­ ularity, maintainability, aesthetics, and human interface features of the product. In fact, these are aspects of the products that often are instrumental in determining its success or failure in the marketplace. Optimizing these and other product features is the primary role of Electronic Equipment Packaging Technology. As the electronics industry continues to provide products that operate faster than their predecessors in a smaller space with a reduced cost per function, the role of electronic packaging technology will assume an even greater role in the development of cost-effective products.

Product Details

ISBN-13:	9780442238186
Publisher:	Springer US
Publication date:	02/27/1992
Edition description:	1992
Pages:	279
Product dimensions:	6.10(w) x 9.25(h) x 0.03(d)

Table of Contents

1 Packaging Implementation.- 1.1 Related General Packaging Issues.- 1.2 Levels of Packaging.- 1.3 Design Implementation Team.- 1.4 Product Applications.- 1.5 Packaging Priorities.- References.- 2 Integrated Circuits.- 2.1 Process Technology.- 2.2 Application-Specific Integrated Circuits.- References.- 3 Circuit Component Packages.- 3.1 Electronic Circuit Components.- 3.2 Electromechanical Circuit Components.- 3.3 Mechanical Circuit Component Hardware.- References.- 4 Multiple Bare Die Packaging Technologies.- 4.1 Bare-Die Termination Techniques.- 4.2 Hybrid Microcircuits.- 4.3 Chip-on-Board Technology.- 4.4 Multichip Modules.- References.- 5 Packaged Component Subassemblies.- 5.1 Electrical Performance.- 5.2 Packaging and Interconnecting (P&I) Structures.- 5.3 General Assembly Selection Considerations.- 5.4 Through-hole Technology.- 5.5 Surface Mount Technology (SMT).- References.- 6 Subassembly Interconnection Systems.- 6.1 Backplane Structures.- 6.2 Backplane Connectors.- 6.3 Discrete Solderless-wrap Backplane Wiring.- References.- 7 Wiring and Cabling Assemblies.- 7.1 Electrical Characteristics.- 7.2 Wire and Cable Materials.- 7.3 Wire and Cable Configurations.- 7.4 Cabling Connectors.- 7.5 Wire Terminations.- References.- 8 Electronic Equipment Enclosures.- 8.1 General Enclosure Selection Considerations.- 8.2 Cabinets.- 8.3 Small Equipment Enclosures.- 8.4 Portable Carrying Cases.- 8.5 Printed Board Enclosures.- References.- 9 Thermal Management.- 9.1 Basic Thermal Management Considerations.- 9.2 General Thermal Analysis.- 9.3 Heat Sinks.- 9.4 Air Movers (Fans and Blowers.- 9.5 Liquid Cooling.- 9.6 Thermoelectric Heat Pump Modules.- References.- 10 End Product Applications.- 10.1 Consumer Electronics.- 10.2 Data Processing Equipment (Computers).- 10.3 Aircraft (Avionics) Equipment.- 10.4 Military Shipboard Electronics.- 10.5 Biomedical Electronics.- References.

Editorial Reviews

Explores principles and procedures for putting integrated circuits and other tiny but clever miracles of the electronics industry, into arrangements and, eventually, cases that will protect them, will not interfere with their operation, and will provide the user with a product that is easy to use, durable, and pleasing. A guide for engineers involved in the manufacture or design of electronic components and devices. Annotation c. Book News, Inc., Portland, OR (booknews.com)

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