Electronic Packaging and Interconnection Handbook / Edition 4

by Charles A. Harper

Overview

Publisher's Note: Products purchased from Third Party sellers are not guaranteed by the publisher for quality, authenticity, or access to any online entitlements included with the product.


THE MOST COMPREHENSIVE REFERENCE IN ELECTRONIC PACKAGING—COMPLETELY UPDATED

From new materials and technologies to increasingly prevalent lead-free manufacturing practices, Electronic Packaging and Interconnection Handbook offers a unique source of key reference data, practical guidance, and circuit and package design basics. Through three best-selling editions, this classic reference has served those involved in the design, manufacture, testing, and use of all types of electronic packaging, becoming the most widely used reference in the industry. This thoroughly revised and expanded Fourth Edition adds new information on key MEMs; optoelectronic, single-chip, and high-speed technologies; and updates important chapters on ball grid array and flip chip technologies.

Of interest to mechanical and electrical engineers, chemists, physicists, and materials scientists in all areas of the electronic packaging industry, the book takes a unique interdisciplinary approach to the field, allowing specialists in one area to understand the needs and responsibilities of others.

Whether your area of expertise is design and manufacturing, quality control, or marketing, it's easy to see why the Fourth Edition of the Electronic Packaging and Interconnection Handbook makes an excellent addition to your reference arsenal.

Written by a team of experts from around the globe, this remarkable volume covers all aspects of electronic packaging, including:

• Materials
• Thermal Management
• Shock, Vibration, and Operational Stress Management
• Connector and Interconnection Technologies
• Soldering and Cleaning Technologies
• Single Chip Packaging and Ball Grid Arrays
• Surface Mount Technology
• Hybrid and Multichip Modules
• Chip-Scale, Flip-Chip, and Direct-Chip Attachment
• Rigid and Flexible Printed-Wiring Boards
• Packaging High-Speed and Microwave Systems
• Packaging High-Voltage Systems
• Packaging of MEMs Systems
• Packaging of Optoelectronic Systems

Product Details

ISBN-13:	9780071430487
Publisher:	McGraw Hill LLC
Publication date:	09/28/2004
Edition description:	REV
Pages:	1000
Product dimensions:	7.30(w) x 9.50(h) x 2.77(d)

About the Author

Charles A. Harper is president of Technology Seminars, Inc., Lutherville, Maryland, an organization dedicated to the presentation of educational seminars on electronic packaging and materials. He has authored over a dozen well-known books in the field and is among the founders and past presidents of the International Microelectronics and Packaging Society. He is also series editor for the McGraw-Hill Electronic Packaging and Interconnection Series. Mr. Harper is a graduate of the Johns Hopkins University School of Engineering, where he also served as adjunct professor.

Table of Contents

CONTRIBUTORS
PREFACE

Chapter 1: Plastics, Elastomers, and Composites

Chapter 2: Adhesives, Underfills, and Coatings

Chapter 3: Thermal Management

Chapter 4: Connector and Interconnection Technology

Chapter 5: Solder Technologies for Electronic Packaging and Assembly

Chapter 6: Packaging and Interconnection of Integrated Circuits

Chapter 7: Hybrid Microelectronics and Multichip Modules

Chapter 8: Chip Scale, Flip Chip, and Advanced Chip Packaging Technologies

Chapter 9: Rigid and Flexible Printed Circuit Board Technology

Chapter 10: Packaging of High-Speed and Microwave Electronic Systems
INDEX

Editorial Reviews

Intended for electronic engineers, this handbook describes the various approaches to handling thermal management issues in electronic packaging, the function and structure of connectors, and the properties of solder technologies for electronic assembly. Other topics of the ten chapters include integrated circuit packaging, ball grid arrays, hybrid microelectronics, multichip modules, chip scale packaging, flip chip attachment, and printed wiring boards. Originally published as Handbook of Electronic Packaging, the fourth edition adds material on microelectromechanical (MEM) systems and high speed technologies.

Sci-Tech Book News

New edition of a reference that covers all aspects of electronic packaging and its associated technologies. Harper (Technology Seminars, Inc.) includes contributions from leading experts to provide data, information and guidelines on topics including materials, thermal management, mechanical and thermomechanical stress behavior, connector and interconnection technology, wiring and cabling, soldering and solder technology, IC packaging and ball grid arrays, surface mount technologies, hybrid microelectronic and multichip modules, chip-scale and direct-chip-attach technologies, rigid and flexible printed-wiring boards, modeling, and high-speed, microwave, and high-voltage electronic systems. Contains many b&w illustrations. Annotation c. Book News, Inc., Portland, OR (booknews.com)

Booknews