Table of Contents
Preface. Performance Predictions. Possibilities of Thermal Resonance in Microcircuits; G. De Mey. Signal Integrity Analysis in Cost Sensitive Interconnections; P. Svasta, et al. The Use of Nonlinearity Measurements for the Reliability Assessment; P.J. Mach. Effect of Plastic Package Geometry on its Propensity to Moisture Induced Failure; E. Suhir. The Impact of Stress on the Noise, Quality and Reliability of Passive and Active Devices; J. Sikula, P. Vasina. Process and Materials Development. Smart Unit for Technological Monitoring in Electrochemical Industry; R. Ionescu, et al. Lower Patterning of Printed Wiring Boards for MCM-Ls; ZS. Illyefalvi-Vitéz, et al. Silver Filled Adhesives-Controlling Rheology and Electrical Conductivity; P. Sexton, et al. Silicides Formation in Metal-Silicon Film Systems: The Role of Impurities; Yu. Makogon, S.I. Sidorenko. Mechanical properties of Pb-Sn-In-Ag Solders from -100°C to 150°C; W.K. Jones, et al. MCM-D/L. The Need for Low Cost, High Density Packaging and Interconnect Technology; P. Garrou. Application of Electroconducting Polymers in Low Cost Devices; G. Harsanyi, et al. Photosensitive Polymer Thick Films; S. Achmatowicz, et al. Characteristics of Passive Ta-Resistive Planes Embedded in Al-Sheet ‘PCB'-Compatible for Integrated MCM-Substrates or Packaging Carriers; P. Philippov. MCM-C. Use of Gravure Offset Printing in Manufacturing of Electronic Applications; S.J. Leppävuori, A.K. Uusimäki. Investigation of Thick Film Resistors for a Multilayer System; M. Hrovat, et al. Reliability Aspects of the Batch Production Based on PTF Technology; M. Somora, et al. A Five Layer Thin Film MCM-Si Design Using Oxynitride Dielectrics; J. Lernout, et al. Packaging Applications. An ASIC View of Low Cost Packaging; P.R. Van Loan. Packaging Technologies for Thick Film Sensors; D. Belavič, et al. Radiation Hardened ASIC Design for Space Applications; J. Trontelj, L. Trontelj. Low Cost Packaging Encoder Circuits; S. Amon, et al. Microwave Filters Manufactured by Advanced Thick-Film Techniques and Novel Silver Pastes; M. Cież, et al. Systems Level Packaging. System Reliability; N. Sinnadurai. Capabilities and Limitations in Microelectronic Packaging and Assembly within the FSU; S. Muckett. MCM-L in IBM Technology Overview; G. Vendramin. Applications of the Interconnected Mesh Power System (IMPS) Substrate Layer Reduction Topology; L.W. Schaper. Flip Chip and BGA Assembly. Plastic Ball Grid Array (PBGA): A Rising Package Solution; K. Kurzweil, et al. Low Cost Flip Chip on Glass Epoxy FR4 Substrates for Personal Electronics; N. Van Veen. Chip Stacking using Flip Chip Technologies; M. Amskov. Flip Chip Joining Technology Applications; J. Vähäkangas, et al. Novel Underfills: Effect of the Filler for Fast-Flow Underfills and Latent Catalyst for No-Flow Underfills on the Processing of Flip Chip Devices; C.P. Wong, et al. Author Index. Keyword Index.
