Handbook of VLSI Microlithography / Edition 2

by John N. Helbert

Overview

This handbook gives readers a close look at the entire technology of printing very high resolution and high density integrated circuit (IC) patterns into thin resist process transfer coatings—including optical lithography, electron beam, ion beam, and x-ray lithography. The book's main theme is the special printing process needed to achieve volume high density IC chip production, especially in the Dynamic Random Access Memory (DRAM) industry. The book leads off with a comparison of various lithography methods, covering the three major patterning parameters of line/space, resolution, line edge and pattern feature dimension control. The book's explanation of resist and resist process equipment technology may well be the first practical description of the relationship between the resist process and equipment parameters. The basics of resist technology are completely covered—including an entire chapter on resist process defectivity and the potential yield limiting effect on device production.Each alternative lithographic technique and testing method is considered and evaluated: basic metrology including optical, scanning-electron-microscope (SEM) techniques and electrical test devices, along with explanations of actual printing tools and their design, construction and performance. The editor devotes an entire chapter to today's sophisticated, complex electron-beam printers, and to the emerging x-ray printing technology now used in high-density CMOS devices. Energetic ion particle printing is a controllable, steerable technology that does not rely on resist, and occupies a final section of the handbook.

Product Details

ISBN-13:	9780815514442
Publisher:	Elsevier Science
Publication date:	12/31/2001
Series:	Materials Science and Process Technology Series
Edition description:	2ND
Pages:	1022
Product dimensions:	6.00(w) x 9.00(h) x (d)

About the Author

John Helbert is a Senior Member of the Motorola Technical Staff. He earned his doctorate in Physical Chemistry from Wayne State University and has worked extensively in the areas of Radiation and Photochemistry, and more recently in the related applied area of Photolithography. His current research and development efforts focus on the areas of I-line and DUV photoresist process development/optimization, photolithographic defect process reduction, lithographic modeling, and high NA stepper characterization and applications. Helbert has been session chairman and meeting co-chairman of several international lithographic meetings, has co-authored over 120 technical papers, written two book chapters and edited a book, all in the field of Microlithography and related subjects. He is also the holder of 4 patents and is a Motorola Technical Society member with Silver and Gold Quill status. He is a member of the corporate lithographic TAB advisory group.

Table of Contents

Issues and Trends Affecting Lithography Tool Selection StrategyResist Technology: Design, Processing and ApplicationsLithography Process Monitoring and Defect DetectionTechniques and Tools for Photo MetrologyTechniques and Tools for Optical LithographyMicrolithography Tool AutomationElectron Beam ULSI ApplicationsRational Vibration and Structural Dynamics for Lithographic Tool InstallationsApplications of Ion Microbeam Lithography and Direct ProcessingX-Ray Lithography

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From the Publisher

A close look at the entire technology of printing very high resolution and high density integrated circuit patterns into thin resist process pattern transfer coatings.