Heterogeneous Optoelectronic Integration

by Elias Towe, SPIE--The International Society for Optical Engineering Staff

Overview

Numerous efforts are directed at investigating the use of optics at short distances, for example, at the chip-to-chip and board-to-board levels of the interconnection hierarchy. This book provides an overview of the state-of-the-art in heterogeneous integration of electronics, optoelectronics, and micro-optics for short-distance optical interconnections.

Product Details

ISBN-13:	9780819435712
Publisher:	SPIE Press
Publication date:	11/10/2000
Series:	Press Monographs
Pages:	282
Product dimensions:	6.50(w) x 1.50(h) x 9.50(d)

Editorial Reviews

Describes several approaches to developing the basic technologies necessary for optical interconnections at the board-to-board level, focusing on the integration of electronics, optoelectronics, and micro-optics for short-distance optical interconnections. The first few of the seven chapters present epitaxy-on-electronics, silicon-on-gallium-arsenide, and aligned-pillar-bonding techniques; vertical-cavity surface-emitting lasers designed for integration with electronic circuits; and methods of bonding vertical-cavity surface- emitting laser arrays to CMOS integrated circuits. The remaining chapters discuss heterogeneous and monolithic integration for optical interconnects, large scale heterogeneous optoelectronic integration, integration of chips onto functional three-dimensional cubes, and scalable micro-optical modules for short distance VLSI-photonic interconnections. Annotation c. Book News, Inc., Portland, OR (booknews.com)

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