Materials for Electronic Packaging

by Deborah D.L. Chung

Overview

Although materials play a critical role in electronic packaging, the vast majority of attention has been given to the systems aspect. Materials for Electronic Packaging targets materials engineers and scientists by focusing on the materials perspective.

The last few decades have seen tremendous progress in semiconductor technology, creating a need for effective electronic packaging. Materials for Electronic Packaging examines the interconnections, encapsulations, substrates, heat sinks and other components involved in the packaging of integrated circuit chips. These packaging schemes are crucial to the overall reliability and performance of electronic systems.

Product Details

ISBN-13:	9780750693141
Publisher:	Elsevier Science
Publication date:	04/05/1995
Pages:	368
Product dimensions:	6.34(w) x 9.50(h) x (d)

About the Author

Professor Deborah D.L. Chung, Composite Materials Research Laboratory, University at Buffalo, State University of New York

Table of Contents

Overview of materials for electronic packagingSolderability fundamentals: role of microscopic processesDetermining the damaging strains which cause failure in lead tin soldersFluxless soldering for microelectronic applications, The effect of microstructure on the bonding of metal/ceramic interfacesThe future of advanced composite electronic packagingLow thermal expansion composite materials for electronic packagingElectrically conducting polymer-matrix compositesThick-film technologyElectroless copper for micropackaging and ultra large scale integrated circuit applicationsVacuum metallization for integrated circuit packagesElectrically conducting polymers and organic materialsDiamond filmsMeasurements of properties of materials in electronic packaging

Editorial Reviews

Government and academic researchers present 16 self-contained tutorial chapters that examine all aspects of electronic packaging from a materials perspective, a shadowy area to most workers in the field whose education is in electrical engineering. They consider the packaging of integrated circuit chips; the interconnections for signal transmission, power, and ground; the encapsulations for protecting the chips and interconnections from moisture, chlorides, and other environmental factors; the heat sinks or other cooling devices needed to remove heat from the chips; the power supply; and the housing for electromagnetic interference shielding. Composites, metal films, polymers, and other materials are described, along with processes for joining and materials testing. Annotation c. Book News, Inc., Portland, OR (booknews.com)

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