Mechanical Analysis of Electronic Packaging Systems / Edition 1

by Mckeown

Overview

"Fills the niche between purely technical engineering texts and sophisticated engineering software guides-providing a pragmatic, common sense approach to analyzing and remedying electronic packaging configuration problems. Combines classical engineering techniques with modern computing to achieve optimum results in assessment cost and accuracy."

Product Details

ISBN-13:	9780367399818
Publisher:	Taylor & Francis
Publication date:	09/05/2019
Pages:	374
Product dimensions:	6.00(w) x 9.00(h) x (d)

Table of Contents

Analytical tools; thermal performance analysis; mechanical performance analysis; life analysis; other analysis; analysis of test data; reporting and verification.