Self-Organized 3D Integrated Optical Interconnects: with All-Photolithographic Heterogeneous Integration / Edition 1

by Tetsuzo Yoshimura

Overview

Currently, light waves are ready to come into boxes of computers in high-performance computing systems like data centers and super computers to realize intra-box optical interconnects. For inter-box optical interconnects, light waves have successfully been introduced by OE modules, in which discrete bulk-chip OE/electronic devices are assembled using the flip-chip-bonding-based packaging technology. OE modules, however, are not applicable to intra-box optical interconnects, because intra-box interconnects involve “short line distances of the cm–mm order” and “large line counts of hundreds-thousands.” This causes optics excess, namely, excess components, materials, spaces, fabrication efforts for packaging, and design efforts. The optics excess raises sizes and costs of intra-box optical interconnects enormously when they are built using conventional OE modules.

This book proposes the concept of self-organized 3D integrated optical interconnects and the strategy to reduce optics excess in intra-box optical interconnects.

Product Details

ISBN-13:	9789814877046
Publisher:	Jenny Stanford Publishing
Publication date:	03/09/2021
Pages:	380
Product dimensions:	6.00(w) x 9.00(h) x (d)

About the Author

Tetsuzo Yoshimura is currently a professor emeritus at Tokyo University of Technology.

Table of Contents

1. Introduction 2. Guidelines toward Self-Organized 3D Integrated Optical Interconnects 3. Scalable Film Optical Link Modules (S-FOLMs) 4. Optical Waveguide Films with Vertical Mirrors and 3D Optical Circuits 5. Resource Saving All-Photolithographic Heterogeneous Integration: PL-Pack with SORT 6. High-Speed/Small-Size Light Modulators and Optical Switches 7. Self-Organized Lightwave Networks (SOLNETs) 8. Self-Organized 3D Integrated Optical Interconnects: Model Proposals 9. Self-Organized 3D Micro Optical Switching Systems (3D-MOSS): Model Proposals and Predicted Performance 10. Film-Based Integrated Solar Energy Conversion Systems 11. Embodiments Disclosed in Patents 12. Future Challenges

Editorial Reviews

"The book describes 3D optical interconnects intended for high-performance chip and board-level communications.

In the first three chapters, it presents the fundamentals and challenges of optical interconnection and the strategies for scaling at the chip and module level. It then covers, in three chapters, the fundamentals of heterogeneous integrated photonics technologies pioneered by the author's research. The final three chapters, in a hundred pages, treat self-organized lightwave networks—or SOLNET—and develop in detail the technologies for fabrication of the interconnect along with modeling, computer simulation of the performances and experimental validation.

The book is stimulating for a variety of readers—scientists, engineers and students—and will be a useful reference for further research and development in the nascent field of optical interconnections."

Silvano Donati, University of Pavia, Italy

From the Publisher