The Electronic Packaging Handbook / Edition 1

by Glenn R. Blackwell

Overview

The packaging of electronic devices and systems represents a significant challenge for product designers and managers. Performance, efficiency, cost considerations, dealing with the newer IC packaging technologies, and EMI/RFI issues all come into play. Thermal considerations at both the device and the systems level are also necessary.

The Electronic Packaging Handbook, a new volume in the Electrical Engineering Handbook Series, provides essential factual information on the design, manufacturing, and testing of electronic devices and systems.

Co-published with the IEEE, this is an ideal resource for engineers and technicians involved in any aspect of design, production, testing or packaging of electronic products, regardless of whether they are commercial or industrial in nature. Topics addressed include design automation, new IC packaging technologies, materials, testing, and safety.

Electronics packaging continues to include expanding and evolving topics and technologies, as the demand for smaller, faster, and lighter products continues without signs of abatement. These demands mean that individuals in each of the specialty areas involved in electronics packaging-such as electronic, mechanical, and thermal designers, and manufacturing and test engineers-are all interdependent on each others knowledge. The Electronic Packaging Handbook elucidates these specialty areas and helps individuals broaden their knowledge base in this ever-growing field.

Product Details

ISBN-13:	9780849385919
Publisher:	Taylor & Francis
Publication date:	11/29/1999
Series:	Electronics Handbook Series , #4
Edition description:	New Edition
Pages:	638
Product dimensions:	7.00(w) x 10.00(h) x (d)

About the Author

Glenn R. Blackwell

Table of Contents

Fundamentals of the Design Process. Surface Mount Technology. Integrated Circuit Packages. Direct Chip Attach. Circuit Boards. EMC and PCB Design. Hybrid Assemblies. Interconnects. Design for Test. Adhesive and Its Application. Thermal Management. Testing. Inspection. Package/Enclosure. Electronics Package Reliability and Failure Analysis: A Micromechanics-Based Approach. Product Safety and Third-Party Certification. Appendix A: Definitions. Index.

Editorial Reviews

"…highly recommended…enough detail…provides essential factural information on the design, manufacturing, and testing of electronic devices and systems…this book is primarily for engineers and technicians involved in any aspect of design, production, testing, or packaging of electronic products…The book ties together well with references between chapters…well written and edited…each chapter includes a section of bibliographic references and suggested readings."
—Dave Fish, Pandion Electronics, Inc., SMTnet.com

From the Publisher

This handbook for the practicing engineer who needs current information on electronic packaging at the circuit level also assists each specialty group involved<-->electronic, mechanical and thermal designers, and manufacturing and test engineers<-->in understanding the other areas. Emphasizing the need to consider design, manufacturing and test demands during the design phase of any product, the first of the 16 chapters offer introductory material for those new to the electronics packaging field. The balance provides information on circuit boards, electromagnetic compatibility and PCB design, thermal issues, adhesives, flip-chips and ball grid arrays, interconnects, testing, hybrid circuits, failure analysis, and reliability. Annotation c. Book News, Inc., Portland, OR (booknews.com)

Booknews