The Physics of Submicron Lithography / Edition 1

The Physics of Submicron Lithography / Edition 1

by Kamil A. Valiev
ISBN-10:
0306435780
ISBN-13:
9780306435782
Pub. Date:
03/31/1992
Publisher:
Springer US
ISBN-10:
0306435780
ISBN-13:
9780306435782
Pub. Date:
03/31/1992
Publisher:
Springer US
The Physics of Submicron Lithography / Edition 1

The Physics of Submicron Lithography / Edition 1

by Kamil A. Valiev

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$219.99
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Overview

This book is devoted to the physics of electron-beam, ion-beam, optical, and x-ray lithography. The need for this book results from the following considerations. The astonishing achievements in microelectronics are in large part connected with successfully applying the relatively new technology of processing (changing the properties of) a material into a device whose component dimensions are submicron, called photolithography. In this method the device is imaged as a pattern on a metal film that has been deposited onto a transparent substrate and by means of a broad stream of light is transferred to a semiconductor wafer within which the physical structure of the devices and the integrated circuit connections are formed layer by layer. The smallest dimensions of the device components are limited by the diffraction of the light when the pattern is transferred and are approximately the same as the wavelength of the light. Photolithography by light having a wavelength of A ~ 0.4 flm has made it possible to serially produce integrated circuits having devices whose minimal size is 2-3 flm in the 4 pattern and having 10-105 transistors per circuit.

Product Details

ISBN-13: 9780306435782
Publisher: Springer US
Publication date: 03/31/1992
Series: Microdevices
Edition description: 1992
Pages: 493
Product dimensions: 7.01(w) x 10.00(h) x 0.39(d)

Table of Contents

1. Forming Electron Beams of Submicron Cross Section.- 2. The Physics of the Interactions between Fast Electrons and Matter.- 3. The Physics of Ion-Beam Lithography.- 4. The Physics of X-Ray Microlithography.- 5. Optical Lithography.- 6. Procedures for Processing Exposed Resist Films and Resist Mask Topography.
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