5
1
Thermal Copper Pillar Bump: Cooling the micro and graphics processors hotspot areas
415
Thermal Copper Pillar Bump: Cooling the micro and graphics processors hotspot areas
415
4.99
In Stock
Product Details
| BN ID: | 2940166805898 |
|---|---|
| Publisher: | 10?????????? [Japanese] |
| Publication date: | 08/31/2022 |
| Series: | Emerging Technologies in Electronics [Japanese] , #11 |
| Sold by: | PUBLISHDRIVE KFT |
| Format: | eBook |
| Pages: | 415 |
| File size: | 556 KB |
| Language: | Japanese |
From the B&N Reads Blog