Vibration Analysis for Electronic Equipment / Edition 3

by Dave S. Steinberg

Overview

This book deals with the analysis of various types of vibration environments that can lead to the failure of electronic systems or components.

Product Details

ISBN-13:	9780471376859
Publisher:	Wiley
Publication date:	07/11/2000
Edition description:	REV
Pages:	440
Sales rank:	251,606
Product dimensions:	6.40(w) x 9.50(h) x 1.10(d)

About the Author

Dave S. Steinberg is the author of Vibration Analysis for Electronic Equipment, 3rd Edition, published by Wiley.

Table of Contents

Preface xvii

List of Symbols xix

1 Introduction 1

2 Vibrations of Simple Electronic Systems 17

3 Component Lead Wire and Solder Joint Vibration Fatigue Life 39

4 Beam Structures for Electronic Subassemblies 56

5 Component Lead Wires as Bents, Frames, and Arcs 75

6 Printed Circuit Boards and Flat Plates 103

7 Octave Rule, Snubbing, and Damping to Increase the PCB Fatigue Life 150

8 Preventing Sinusoidal Vibration Failures in Electronic Equipment 166

9 Designing Electronics for Random Vibration 188

10 Acoustic Noise Effects on Electronic 234

11 Designing Electronics for Shock Environments 248

12 Design and Analysis of Electronic Boxes 300

13 Effects of Manufacturing Methods on the Reliability of Electronics 330

14 Vibration Fixtures and Vibration Testing 346

15 Environmental Stress Screening for Electronic Equipment (ESSEE) 379

Bibliography 401

Index 405

Editorial Reviews

Without noting the dates for the first two, Steinberg (U. of California-Los Angeles) has made extensive changes in the third edition to reflect the dramatic reduction in electronics that makes them affordable in many applications that were once good enough as mechanical devices. A major concern of his is the adoption of commercial equipment and standards by the military. Among the new chapters are discussions of the effects of manufacturing methods and tolerances on the reliability of the electronic hardware, methods for improving the ruggedness of commercial hardware for improved reliability in harsh military environments, the bending distortion of the circuit board at its resonant condition, and environmental stress screening. Annotation c. Book News, Inc., Portland, OR (booknews.com)

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