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Title: Microscale Heat Transfer - Fundamentals and Applications: Proceedings of the NATO Advanced Study Institute on Microscale Heat Transfer - Fundamentals and Applications in Biological and Microelectromechanical Systems, Cesme-Izmir, Turkey, 18-30 July, 2004 / Edition 1, Author: S. Kakaï
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Title: Mechanical Analysis of Electronic Packaging Systems / Edition 1, Author: Mckeown
Title: Hermeticity of Electronic Packages / Edition 2, Author: Hal Greenhouse
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Title: Contamination of Electronic Assemblies / Edition 1, Author: Elissa M. Bumiller
Title: Handbook of Lead-Free Solder Technology for Microelectronic Assemblies / Edition 1, Author: Karl J. Puttlitz

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