Title: Adhesives Technology for Electronic Applications: Materials, Processing, Reliability, Author: James J. Licari
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eBook $191.49 $225.00 Current price is $191.49, Original price is $225.00.
Title: Adhesives Technology for Electronic Applications: Materials, Processing, Reliability / Edition 2, Author: James J. Licari
Title: Advanced Materials for Thermal Management of Electronic Packaging / Edition 1, Author: Xingcun Colin Tong
Title: Advanced Wirebond Interconnection Technology / Edition 1, Author: Shankara K. Prasad
Title: Air Cooling Technology for Electronic Equipment / Edition 1, Author: Sung Jin Kim
Title: Boundary-Scan Interconnect Diagnosis / Edition 1, Author: Josï T. de Sousa
Title: CAE - CAD and Thermal Management Issues in Electronic Systems: Proceedings, ASME International Mechanical Engineering Congress and Exposition, Dallas, TX, 1997, Author: Dereje Agonafer
Title: Chip On Board: Technology for Multichip Modules / Edition 1, Author: John H. Lau
Title: Contamination of Electronic Assemblies / Edition 1, Author: Elissa M. Bumiller
Title: Electronic Equipment Packaging Technology / Edition 1, Author: Gerald L. Ginsberg
Title: Electronic Packaging and Interconnection Handbook / Edition 4, Author: Charles A. Harper
Title: Electronic Packaging for High Reliability, Low Cost Electronics, Author: R.R. Tummala
Title: Electronic Packaging Materials and Their Properties / Edition 1, Author: Michael Pecht
Title: Electronics Packaging Forum: Volume Two, Author: James E. Morris
Title: Failure Modes and Mechanisms in Electronic Packages / Edition 1, Author: P. Singh
Title: Fundamentals and Essentials of Electronic Packaging, Author: Puligandla Viswanadham
Title: Guidebook for Managing Silicon Chip Reliability / Edition 1, Author: Michael Pecht
Title: Handbook of Electronic Package Design, Author: Michael Pecht
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eBook $393.99 $525.00 Current price is $393.99, Original price is $525.00.
Title: Handbook Of Electronics Packaging Design and Engineering, Author: Bernard S. Matisoff
Title: Handbook of Lead-Free Solder Technology for Microelectronic Assemblies / Edition 1, Author: Karl J. Puttlitz

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