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Title: Materials for High-Density Electronic Packaging and Interconnection, Author: National Research Council
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Materials for High-Density…
by National Research Council, Division on Engineering and Physical Sciences, National Materials Advisory Board, Commission on Engineering and Technical Systems, Committee on Materials for High-Density Electronic Packaging
Paperback $48.00
Title: Handbook of Polymer Coatings for Electronics: Chemistry, Technology and Applications / Edition 2, Author: James J. Licari
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Handbook of Polymer Coatings…
by James J. Licari, Laura A. Hughes
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Hardcover $155.00
Title: Handbook of Polymer Coatings for Electronics: Chemistry, Technology and Applications, Author: James J. Licari
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Handbook of Polymer Coatings…
by James J. Licari, Laura A. Hughes
eBook $123.49 $145.00 Current price is $123.49, Original price is $145.00.
Title: Handbook Of Tape Automated Bonding / Edition 1, Author: John H. Lau
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Handbook Of Tape Automated…
by John H. Lau
Hardcover $219.99
Title: Electronic Equipment Packaging Technology / Edition 1, Author: Gerald L. Ginsberg
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Electronic Equipment Packaging…
by Gerald L. Ginsberg
Hardcover $109.99
Title: The Basics of Soldering / Edition 1, Author: Armin Rahn
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The Basics of Soldering /…
by Armin Rahn
Hardcover $312.95
Title: Multilayer Ceramic Substrate - Technology for VLSI Package/Multichip Module: Ceramic research and development in Japan / Edition 1, Author: K. Otsuka
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Multilayer Ceramic Substrate -…
by K. Otsuka
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Hardcover $329.99
Title: Soldering Processes and Equipment / Edition 1, Author: Michael Pecht
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Soldering Processes and…
by Michael Pecht
Hardcover $177.95
Title: Physical Design for Multichip Modules / Edition 1, Author: Mysore Sriram
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Physical Design for Multichip…
by Mysore Sriram, Sung-Mo (Steve) Kang
#267 in Series
Hardcover $169.99
Title: Integrated Circuit, Hybrid, and Multichip Module Package Design Guidelines: A Focus on Reliability / Edition 1, Author: Michael Pecht
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Integrated Circuit, Hybrid,…
by Michael Pecht
Hardcover $212.95
Title: Chip On Board: Technology for Multichip Modules / Edition 1, Author: John H. Lau
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Chip On Board: Technology for…
by John H. Lau
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Hardcover $219.99
Title: Quality Conformance and Qualification of Microelectronic Packages and Interconnects / Edition 1, Author: Michael Pecht
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Quality Conformance and…
by Michael Pecht, Abhijit Dasgupta, John W. Evans, Jillian Y. Evans
Paperback $188.95
Title: Materials for Electronic Packaging, Author: Deborah D.L. Chung
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Materials for Electronic…
by Deborah D.L. Chung
eBook $210.49 $280.00 Current price is $210.49, Original price is $280.00.
Title: Materials for Electronic Packaging, Author: Deborah D.L. Chung
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Materials for Electronic…
by Deborah D.L. Chung
Hardcover $300.00
Title: MCM C/Mixed Technologies and Thick Film Sensors / Edition 1, Author: W.K. Jones
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MCM C/Mixed Technologies and…
by W.K. Jones, Karel Kurzweil, Gábor Harsányi, Sylvia Mergui
#2 in Series
Hardcover $219.99
Title: Laser Diode Chip and Packaging Technology, Author: Pei C. Chen
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Laser Diode Chip and Packaging…
by Pei C. Chen, Tomas D. Milster
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Paperback $66.00
Title: Air Cooling Technology for Electronic Equipment / Edition 1, Author: Sung Jin Kim
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Air Cooling Technology for…
by Sung Jin Kim, Sang Woo Lee
Hardcover $77.99
Title: The Handbook of Machine Soldering: SMT and TH / Edition 3, Author: Ralph W. Woodgate
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The Handbook of Machine…
by Ralph W. Woodgate
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Hardcover $218.95
Title: High Temperature Electronics / Edition 1, Author: F. Patrick McCluskey
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High Temperature Electronics /…
by F. Patrick McCluskey, Thomas Podlesak, Richard Grzybowski
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Hardcover $230.00
Title: CAE - CAD and Thermal Management Issues in Electronic Systems: Proceedings, ASME International Mechanical Engineering Congress and Exposition, Dallas, TX, 1997, Author: Dereje Agonafer
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CAE - CAD and Thermal…
by Dereje Agonafer (Editor)
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Paperback $72.00

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