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Title: Influence of Temperature on Microelectronics and System Reliability: A Physics of Failure Approach, Author: Pradeep Lall
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Influence of Temperature on…
by Pradeep Lall, Michael G. Pecht, Edward B. Hakim
eBook $41.49 $54.95 Current price is $41.49, Original price is $54.95.
Title: Modeling and Design of Electromagnetic Compatibility for High-Speed Printed Circuit Boards and Packaging, Author: Xing-Chang Wei
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Modeling and Design of…
by Xing-Chang Wei
eBook $44.99 $59.95 Current price is $44.99, Original price is $59.95.
Title: Practical Guide to the Packaging of Electronics: Thermal and Mechanical Design and Analysis, Third Edition, Author: Ali Jamnia
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Practical Guide to the…
by Ali Jamnia
eBook $46.49 $61.99 Current price is $46.49, Original price is $61.99.
Title: Materials for High-Density Electronic Packaging and Interconnection, Author: National Research Council
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Materials for High-Density…
by National Research Council, Division on Engineering and Physical Sciences, National Materials Advisory Board, Commission on Engineering and Technical Systems, Committee on Materials for High-Density Electronic Packaging
Paperback $48.00
Title: Electronic Packaging Materials and Their Properties, Author: Michael Pecht
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Electronic Packaging Materials…
by Michael Pecht, Rakish Agarwal, F. Patrick McCluskey, Terrance J. Dishongh, Sirus Javadpour
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eBook $50.49 $66.99 Current price is $50.49, Original price is $66.99.
Title: Guidebook for Managing Silicon Chip Reliability / Edition 1, Author: Michael Pecht
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Guidebook for Managing Silicon…
by Michael Pecht, Riko Radojcic, Gopal Rao
#5 in Series
Paperback $54.95
Title: Influence of Temperature on Microelectronics and System Reliability: A Physics of Failure Approach / Edition 1, Author: Pradeep Lall
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Influence of Temperature on…
by Pradeep Lall, Michael G. Pecht, Edward B. Hakim
Paperback $54.95
Title: Electronics Packaging Forum: Volume Two, Author: James E. Morris
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Electronics Packaging Forum:…
by James E. Morris
Paperback $54.99
Title: Handbook Of Electronics Packaging Design and Engineering, Author: Bernard S. Matisoff
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Handbook Of Electronics…
by Bernard S. Matisoff
Paperback $54.99
Title: Handbook Of Electronics Packaging Design and Engineering, Author: Bernard S. Matisoff
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Handbook Of Electronics…
by Bernard S. Matisoff
Paperback $54.99
Title: Air Cooling Technology for Electronic Equipment, Author: Sung Jin Kim
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Air Cooling Technology for…
by Sung Jin Kim (Editor), Sang Woo Lee (Editor)
eBook $58.49 $77.99 Current price is $58.49, Original price is $77.99.
Title: Guidebook for Managing Silicon Chip Reliability, Author: Michael Pecht
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Guidebook for Managing Silicon…
by Michael Pecht, Riko Radojcic, Gopal Rao
#5 in Series
eBook $59.99 $79.95 Current price is $59.99, Original price is $79.95.
Title: High Temperature Electronics, Author: F. Patrick McCluskey
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High Temperature Electronics
by F. Patrick McCluskey, Thomas Podlesak, Richard Grzybowski
eBook $62.49 $82.99 Current price is $62.49, Original price is $82.99.
Title: Laser Diode Chip and Packaging Technology, Author: Pei C. Chen
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Laser Diode Chip and Packaging…
by Pei C. Chen, Tomas D. Milster
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Paperback $66.00
Title: CAE - CAD and Thermal Management Issues in Electronic Systems: Proceedings, ASME International Mechanical Engineering Congress and Exposition, Dallas, TX, 1997, Author: Dereje Agonafer
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CAE - CAD and Thermal…
by Dereje Agonafer (Editor)
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Paperback $72.00
Title: Air Cooling Technology for Electronic Equipment / Edition 1, Author: Sung Jin Kim
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Air Cooling Technology for…
by Sung Jin Kim, Sang Woo Lee
Hardcover $77.99
Title: Contamination of Electronic Assemblies / Edition 1, Author: Elissa M. Bumiller
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Contamination of Electronic…
by Elissa M. Bumiller, David A. Douthit, Joan Pecht
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Paperback $82.99
Title: High Temperature Electronics / Edition 1, Author: F. Patrick McCluskey
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High Temperature Electronics /…
by F. Patrick McCluskey, Thomas Podlesak, Richard Grzybowski
Paperback $82.99
Title: Mechanical Analysis of Electronic Packaging Systems / Edition 1, Author: Mckeown
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Mechanical Analysis of…
by Mckeown
Paperback $82.99
Title: High-Frequency Characterization of Electronic Packaging / Edition 1, Author: Luc Martens
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High-Frequency…
by Luc Martens
#1 in Series
Hardcover $109.99

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