Title: Adhesives Technology for Electronic Applications: Materials, Processing, Reliability / Edition 2, Author: James J. Licari
Title: Advanced Materials for Thermal Management of Electronic Packaging / Edition 1, Author: Xingcun Colin Tong
Title: Advanced Wirebond Interconnection Technology / Edition 1, Author: Shankara K. Prasad
Title: Air Cooling Technology for Electronic Equipment / Edition 1, Author: Sung Jin Kim
Title: Boundary-Scan Interconnect Diagnosis / Edition 1, Author: Josï T. de Sousa
Title: Chip On Board: Technology for Multichip Modules / Edition 1, Author: John H. Lau
Title: Contamination of Electronic Assemblies / Edition 1, Author: Elissa M. Bumiller
Title: Electronic Equipment Packaging Technology / Edition 1, Author: Gerald L. Ginsberg
Title: Electronic Packaging and Interconnection Handbook / Edition 4, Author: Charles A. Harper
Title: Electronic Packaging Materials and Their Properties / Edition 1, Author: Michael Pecht
Title: Failure Modes and Mechanisms in Electronic Packages / Edition 1, Author: P. Singh
Title: Fundamentals and Essentials of Electronic Packaging, Author: Puligandla Viswanadham
Title: Guidebook for Managing Silicon Chip Reliability / Edition 1, Author: Michael Pecht
Title: Handbook of Lead-Free Solder Technology for Microelectronic Assemblies / Edition 1, Author: Karl J. Puttlitz
Title: Handbook of Polymer Coatings for Electronics: Chemistry, Technology and Applications / Edition 2, Author: James J. Licari
Title: Handbook Of Tape Automated Bonding / Edition 1, Author: John H. Lau
Title: Hermeticity of Electronic Packages / Edition 2, Author: Hal Greenhouse
Title: High Temperature Electronics / Edition 1, Author: F. Patrick McCluskey
Title: High-Frequency Characterization of Electronic Packaging / Edition 1, Author: Luc Martens
Title: Influence of Temperature on Microelectronics and System Reliability: A Physics of Failure Approach / Edition 1, Author: Pradeep Lall

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