Title: Guidebook for Managing Silicon Chip Reliability / Edition 1, Author: Michael Pecht
Title: Influence of Temperature on Microelectronics and System Reliability: A Physics of Failure Approach / Edition 1, Author: Pradeep Lall
Title: Laser Diode Chip and Packaging Technology, Author: Pei C. Chen
Title: Air Cooling Technology for Electronic Equipment / Edition 1, Author: Sung Jin Kim
Title: Contamination of Electronic Assemblies / Edition 1, Author: Elissa M. Bumiller
Title: High Temperature Electronics / Edition 1, Author: F. Patrick McCluskey
Title: Mechanical Analysis of Electronic Packaging Systems / Edition 1, Author: Mckeown
Title: High-Frequency Characterization of Electronic Packaging / Edition 1, Author: Luc Martens
Title: Package Electrical Modeling, Thermal Modeling, and Processing for GaAs Wireless Applications / Edition 1, Author: Dean L. Monthei
Title: Manufacturing Challenges in Electronic Packaging / Edition 1, Author: Y.C. Lee
Title: Electronic Equipment Packaging Technology / Edition 1, Author: Gerald L. Ginsberg
Title: Fundamentals and Essentials of Electronic Packaging, Author: Puligandla Viswanadham
Title: Guidebook for Managing Silicon Chip Reliability / Edition 1, Author: Michael Pecht
Title: Influence of Temperature on Microelectronics and System Reliability: A Physics of Failure Approach / Edition 1, Author: Pradeep Lall
Title: Handbook of Polymer Coatings for Electronics: Chemistry, Technology and Applications / Edition 2, Author: James J. Licari
Title: Physical Design for Multichip Modules / Edition 1, Author: Mysore Sriram
Title: Boundary-Scan Interconnect Diagnosis / Edition 1, Author: Josï T. de Sousa
Title: Failure Modes and Mechanisms in Electronic Packages / Edition 1, Author: P. Singh
Title: Soldering Processes and Equipment / Edition 1, Author: Michael Pecht
Title: LED Packaging for Lighting Applications: Design, Manufacturing, and Testing / Edition 1, Author: Shen Liu

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