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Title: High Temperature Electronics / Edition 1, Author: F. Patrick McCluskey
Title: Contamination of Electronic Assemblies / Edition 1, Author: Elissa M. Bumiller
Title: Mechanical Analysis of Electronic Packaging Systems / Edition 1, Author: Mckeown
Title: Influence of Temperature on Microelectronics and System Reliability: A Physics of Failure Approach / Edition 1, Author: Pradeep Lall
Title: Adhesives Technology for Electronic Applications: Materials, Processing, Reliability / Edition 2, Author: James J. Licari
Title: Advanced Materials for Thermal Management of Electronic Packaging / Edition 1, Author: Xingcun Colin Tong
Title: Power Electronic Packaging: Design, Assembly Process, Reliability and Modeling / Edition 1, Author: Yong Liu
Title: Hermeticity of Electronic Packages / Edition 2, Author: Hal Greenhouse
Title: LED Packaging for Lighting Applications: Design, Manufacturing, and Testing / Edition 1, Author: Shen Liu
Title: Fundamentals and Essentials of Electronic Packaging, Author: Puligandla Viswanadham
Title: Advanced Materials for Thermal Management of Electronic Packaging / Edition 1, Author: Xingcun Colin Tong
Title: Boundary-Scan Interconnect Diagnosis / Edition 1, Author: Josï T. de Sousa
Title: Microscale Heat Transfer - Fundamentals and Applications: Proceedings of the NATO Advanced Study Institute on Microscale Heat Transfer - Fundamentals and Applications in Biological and Microelectromechanical Systems, Cesme-Izmir, Turkey, 18-30 July, 2004 / Edition 1, Author: S. Kakaï
Title: Microscale Heat Transfer - Fundamentals and Applications: Proceedings of the NATO Advanced Study Institute on Microscale Heat Transfer - Fundamentals and Applications in Biological and Microelectromechanical Systems, Cesme-Izmir, Turkey, 18-30 July, 2004 / Edition 1, Author: S. Kakaï
Title: Electronic Packaging and Interconnection Handbook / Edition 4, Author: Charles A. Harper
Title: Advanced Wirebond Interconnection Technology / Edition 1, Author: Shankara K. Prasad
Title: Handbook of Lead-Free Solder Technology for Microelectronic Assemblies / Edition 1, Author: Karl J. Puttlitz
Title: Contamination of Electronic Assemblies / Edition 1, Author: Elissa M. Bumiller
Title: Thermal Design of Electronic Equipment / Edition 1, Author: Ralph Remsburg

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