Title: Influence of Temperature on Microelectronics and System Reliability: A Physics of Failure Approach / Edition 1, Author: Pradeep Lall
Title: MCM C/Mixed Technologies and Thick Film Sensors / Edition 1, Author: W.K. Jones
Title: Materials for Electronic Packaging, Author: Deborah D.L. Chung
Title: Guidebook for Managing Silicon Chip Reliability / Edition 1, Author: Michael Pecht
Title: Soldering Processes and Equipment / Edition 1, Author: Michael Pecht
Title: Physical Design for Multichip Modules / Edition 1, Author: Mysore Sriram
Title: Handbook Of Tape Automated Bonding / Edition 1, Author: John H. Lau
Title: Quality Conformance and Qualification of Microelectronic Packages and Interconnects / Edition 1, Author: Michael Pecht
Title: Advanced Materials for Thermal Management of Electronic Packaging / Edition 1, Author: Xingcun Colin Tong
Title: The Basics of Soldering / Edition 1, Author: Armin Rahn
Title: Contamination of Electronic Assemblies / Edition 1, Author: Elissa M. Bumiller
Title: Adhesives Technology for Electronic Applications: Materials, Processing, Reliability / Edition 2, Author: James J. Licari
Title: Thermal Design of Electronic Equipment / Edition 1, Author: Ralph Remsburg
Title: Mechanical Analysis of Electronic Packaging Systems / Edition 1, Author: Mckeown
Title: Boundary-Scan Interconnect Diagnosis / Edition 1, Author: Josï T. de Sousa
Title: High-Frequency Characterization of Electronic Packaging / Edition 1, Author: Luc Martens
Title: Fundamentals and Essentials of Electronic Packaging, Author: Puligandla Viswanadham
Title: The Handbook of Machine Soldering: SMT and TH / Edition 3, Author: Ralph W. Woodgate
Title: LED Packaging for Lighting Applications: Design, Manufacturing, and Testing / Edition 1, Author: Shen Liu
Title: Air Cooling Technology for Electronic Equipment / Edition 1, Author: Sung Jin Kim

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