Title: Handbook of Polymer Coatings for Electronics: Chemistry, Technology and Applications / Edition 2, Author: James J. Licari
Title: Handbook Of Tape Automated Bonding / Edition 1, Author: John H. Lau
Title: Electronic Equipment Packaging Technology / Edition 1, Author: Gerald L. Ginsberg
Title: The Basics of Soldering / Edition 1, Author: Armin Rahn
Title: Multilayer Ceramic Substrate - Technology for VLSI Package/Multichip Module: Ceramic research and development in Japan / Edition 1, Author: K. Otsuka
Title: Soldering Processes and Equipment / Edition 1, Author: Michael Pecht
Title: Physical Design for Multichip Modules / Edition 1, Author: Mysore Sriram
Title: Integrated Circuit, Hybrid, and Multichip Module Package Design Guidelines: A Focus on Reliability / Edition 1, Author: Michael Pecht
Title: Chip On Board: Technology for Multichip Modules / Edition 1, Author: John H. Lau
Title: Quality Conformance and Qualification of Microelectronic Packages and Interconnects / Edition 1, Author: Michael Pecht
Title: Materials for Electronic Packaging, Author: Deborah D.L. Chung
Title: MCM C/Mixed Technologies and Thick Film Sensors / Edition 1, Author: W.K. Jones
Title: Laser Diode Chip and Packaging Technology, Author: Pei C. Chen
Title: Air Cooling Technology for Electronic Equipment / Edition 1, Author: Sung Jin Kim
Title: The Handbook of Machine Soldering: SMT and TH / Edition 3, Author: Ralph W. Woodgate
Title: High Temperature Electronics / Edition 1, Author: F. Patrick McCluskey
Title: Influence of Temperature on Microelectronics and System Reliability: A Physics of Failure Approach / Edition 1, Author: Pradeep Lall
Title: Failure Modes and Mechanisms in Electronic Packages / Edition 1, Author: P. Singh
Title: Manufacturing Challenges in Electronic Packaging / Edition 1, Author: Y.C. Lee
Title: High-Frequency Characterization of Electronic Packaging / Edition 1, Author: Luc Martens

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